| Afternoon Technical Sessions |
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| Technical Session
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Thermal
Jadeite |
Electronics
Amber/Pearl
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Advanced Packaging & Manufacturing
Leo
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AMD Embedded
Pegasus/Virgo
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Software Experiences
Aquila
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| Session Chair |
Khalid Sheltami
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Allen Hu
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Scott Lin
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Kevin Wu
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Rick Gayle |
| Session Co-Chair |
Ali Akbar |
Eddie Chang |
Steven Lee |
Paul Wu |
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| 2:00-2:18pm |
Kevin Huang, CoolerMaster
Introduction of Advanced Thermal Technologies
TFE2011-004COM |
Irene Hwang, AMD
Client Product Roadmap
TFE 2011-030AMD |
Mike Kelly, Amkor
Through Silicon Via (TSV) Production Development
TFE 2011-001AMC |
Jason Hawken, AMD
USB Technology Overview
TFE2011-027AMD |
Manju Hegde
SW Track Kickoff
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Jay Taylor, AMD
Natural UI – The Second User Interface Revolution
TFE2011-032SW
(2:00–2:30pm) |
| 2:18 - 2:36pm |
Guy Wagner, Ecooling
Best Engineering Practice to Extend the Free Air-Cooling Limit in Tablet Hand Held Devices
TFE2011-024ECO
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TRACK KEYNOTE
Dr. Mohamed Lachemi, P.Eng
Harnessing Academia-Industry Synergy for Economic Development
TFE2011-025RYE
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Gary Chang, Infineon
Extremely High Performance Silicon & Package Technology for High Power Density Voltage Regulations
TFE 2011-008INF
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Steve Roux, Renesas
UASP Benefits & USB 3.0 Hub
TFE2011-013REU
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| 2:36 - 2:54pm |
Winston Zhang, Novark
The Effective Range of Miniature Pulsating Heat Pipe
TFE2011-011NOV
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Toni Hsiao, STMicroelectronics
Clocked Asynchronous DC/DC Controllers
TFE 2011-016STM
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TRACK KEYNOTE
Dr. T. K. Ku - ITRI
3D TSV Stacking IC Technology Challenges & Opportunities
TFE 2011-026ITR
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Steven Lee, Innostor
USB 3.0 Flash Disk Controller & Market
TFE2011-010INN
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Louis Chen,
Cyberlink
Optimizing Video Editing Software with OpenCL
TFE2011-033SW (2:30-3:00pm)
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| 2:54 - 3:12pm |
Geoff Lyon, CoolIT
Cooling the Cloud – Next Gen Server Cooling
TFE2011-003COI
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Li Lieh, Volterra
Improved Efficiency & Reduced Parasitics with Integrated Power
TFE2011-018VOL
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Eric So, SPIL
Innovative Packaging & Technology Solutions
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Gerry Chen, Genesys
Genesys Logic USB3.0 NB CAM Usage Model
TFE2011-005GEN
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Wen-Chien Liu,
ArcSoft
TotalMedia Content Management & Using OpenCL GPU Acceleration
TFE2011-034SW
(3:00–3:30pm)
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| 3:12 - 3:30pm |
PS Lee, GCorelab
High Performance, Energy Efficient Compact Liquid Cooling Technology
TFE2011-023GCO
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Jeongwoo Kim, Hynix
Blazing A Trail to High
Performance Graphics
TFE 2011-006HYN
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Sze Pei Lim, Indium
Creating Pure Indium Solder Joints with Low Voiding
TFE 2011-007IND
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Nilton Maltz, SMSC
USB Graphics & USB Universal Dock
TFE2011-014SMS
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| BREAK |
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| Technical Session
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Thermal
Jadeite |
Electronics
Amber/Pearl
|
Advanced Packaging
& Manufacturing
Leo
|
AMD Embedded
Pegasus/Virgo
|
Software Experiences
Aquila
|
| Session Chair |
Sridhar Sundaram
|
Irene Hwang |
Jason Hawkins |
Anwar Chung |
Rick Gayle |
| Co-Session Chair |
Winston Zhang |
Geoff Lyon |
Eric So |
Steven Goldman |
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| 3:45 - 4:00pm |
Guru Prasad, NXP
DDR3 Migration to DDR4 - DIMM Thermal Sensor and SPD Changes TFE2011-012NXP
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Tetsuo Sato, Renesas (Power)
The Usefulness of a Thermal Sensor Built in DC/DC Converter’s Power SiP
TFE2011-028REP
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Ting-Li Yang, NTU
Effect of Minor Alloy Additions on the Interfacial Reactions with Low Solder Volume for 3D IC Applications
TFE2011-TWU01UNI
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Mike Caubarreaux, AMD
Embedded Enablement Tools
TFE2001-019EMB
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Karl Liu, Corel
Independent Software Vendors and Manufacturing – The Corel/AMD Partnership Success Story
TFE2011-035SW
(3:45–4:15pm)
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| 4:00 - 4:15pm |
Jesse Kim, Vapro
Liquid Chamber – Pool-Boiling Based Heat Spreader
TFE2011-017VAP
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Carl Smith, International Rectifier
The Digital Advantage for Powering Next Generation CPU/GPUs
TFE2011-009IRF
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Zhaoli Gao, Hong Kong University
Performance of High-Brightness LEDs with VACNT-TIM on Aluminum
TFE2011-HKU02
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Mike Caubarreaux, AMD
Small Form Factor Design Challenges
TFE2011-020EMB
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| 4:15-4:30pm |
Khalid Sheltami, AMD
AMD Passive Radiant Solution for Tablets
TFE2011-029AMD
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David Nelaso, AMD
The Evolving Compute Capability of the GPU
(4:15–4:45pm)
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PS Huang, CGU
Determination of Thin-Silicon Die Strength by Pin-on-Elastic-Foundation Test
TFE2011-TWU07UNI
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Todd Roberts, AMD
Embedded Software Ecosystem
TFE2001-021EMB
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David Brebner,
Unlimited Realities
Gestural & Cinematic Interfaces
TFE2011-036SW
(4:15–4:45pm)
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| 4:30-4:45pm |
Ali Akbar Merrikh, AMD
Automatic Fan Control in AMD’s Next Generation Fusion Platforms
TFE2011-031AMD
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HC Yang, NCKU
Viscoplastic Model for Sn2.4Ag Solder Under Thermo-mechanical Fatigue Condition
TFE2011-TWU09UNI
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Todd Roberts, AMD
Coreboot For AMD Embedded Systems
TFE2011-022EMB
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